Lam Research 839-800327-438 Overview
Part Number: 839-800327-438
Manufacturer: Lam Research
Category: Electrostatic Chuck (ESC) – 300mm wafer
Typical Tool Platform: Lam etch / deposition platforms (ex: FLEX, TCP, etc.)
Product Description
The Lam Research 839-800327-438 is a 300mm Electrostatic Chuck (ESC) designed to securely hold semiconductor wafers during plasma processing. ESCs are critical components inside process chambers, ensuring wafer stability, thermal control, and process uniformity during etching or deposition.
Some listings also describe it as a FLEX DX (CORE) ESC Chuck, confirming use in Lam’s FLEX platform process chambers.
Key Functions of the ESC Chuck
1) Wafer Clamping
The electrostatic chuck uses electrostatic force to clamp a 300mm wafer firmly to the chuck surface.
This ensures:
- Precise positioning
- Reduced wafer movement
- Improved process repeatability
2) Thermal Control
ESCs regulate wafer temperature through:
- Embedded heaters
- Helium backside cooling channels
This thermal stability is essential for:
- Uniform etch rates
- Consistent film deposition
3) Plasma Process Stability
During plasma etching or deposition, the ESC:
- Provides electrical isolation
- Maintains uniform RF coupling
- Supports high-precision semiconductor fabrication
Typical Applications
The 839-800327-438 ESC is commonly used in:
- Plasma etch systems
- Dielectric etching
- Metal etching
- Advanced node semiconductor manufacturing
- 300mm wafer fabs
Technical Characteristics (Typical)
| Feature | Description |
|---|---|
| Wafer Size | 300mm |
| Type | Electrostatic Chuck (ESC) |
| Sensors | Often includes temperature sensors |
| Cooling | Helium backside cooling |
| Platform | Lam FLEX / etch platforms |
| Installation | Process chamber internal component |
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Main brand :
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•Shipping Port: Xiamen
•Ship to you via Fedex/DHL/TNT/UPS/EMS
•Package: Original packing with cartons

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