Lam Research 810-107813-206 – Overview
Basic information
- Manufacturer: Lam Research
- Part number: 810-107813-206
- Category: PCB / Power Supply Board
- Typical condition on market: Used / surplus semiconductor spare part
- Typical weight: ~0.75 kg
- Typical market price: ~USD 1,600–1,750 (secondary market)
What this board is
The 810-107813-206 is an ESC HVBP (Electrostatic Chuck High-Voltage Bias Power) board used inside Lam semiconductor wafer processing tools. Listings describe it as a PCB power supply board for ESC/HV bias systems.
It is usually sold as a spare part for maintenance, refurbishment, or tool uptime support.
Function in semiconductor equipment
This board belongs to the electrostatic chuck power system, a critical subsystem in etch and deposition tools.
Key role inside the tool
The board typically provides and controls:
- High-voltage bias power
- Supplies HV bias used to hold wafers on the electrostatic chuck (ESC).
- Stable wafer clamping
- Ensures wafers remain fixed during plasma etch processes.
- Electrical filtering / regulation
- Works together with ESC filter assemblies and related power boards.
- System integration
- Interfaces with tool control electronics and other power modules.
Without a stable ESC power system, wafer positioning and process uniformity cannot be maintained.
Typical compatible/related parts
This board often appears in listings together with related ESC power/filter assemblies, such as:
- 853-064940-018 ESC Filter Assy (remark includes this PN)
- 853-064940-206 / 208 ESC power boards (related assemblies)
This indicates it is part of a larger ESC power subsystem rather than a standalone device.
Typical application equipment
Used in Lam wafer fabrication tools such as:
- Plasma etchers
- Dielectric / conductor etch platforms
- Advanced wafer processing systems
These tools perform atomic-scale fabrication steps required for modern chips.
Summary
Lam Research 810-107813-206 is a high-voltage ESC power supply PCB used in Lam semiconductor manufacturing equipment.
It plays a critical role in:
- Wafer clamping via electrostatic chuck
- HV bias generation and regulation
- Maintaining process stability and yield
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